Wuhan Fengfan International Trade Co.,Ltd. Produkty

OX-401A Low foam zinc plating carrier with PH 6.0-8.0 and solid content >60% as a red-brown transparent viscous liquid surfactant
Cyanide-free Hard Silver Electroplating Process FF-7806 with High Hardness (>120Hv) and Wide Plating Solution Bright Density Range
Cyanide-Free Chemical Silver Process for Electroless Silver Plating with pH <1.5 and Temp. 45~50℃ and Cu2+ <3000 ppm
Cyanide Free Silver Plating Chemical with pH 9-10 and 20-40℃ Operating Temperature for High Efficiency Electroplating
Chemical Gilding PCB FF-7885 with 24K Pure Gold Coating Dense Gold Layer and Good Bonding Force for Electronic Products
FF-5131 Cyanide-free Copper Plating Chemicals for Fast Deposition Stable Process and Uniform Coating
EN 6786 High Phosphorus Electroless Nickel Plating with Fast Deposition Rate Non-Magnetic Semi-Bright to Bright Coatings
FF-5100 Non-cyanide Alkaline Copper Plating Chemicals for Fast Deposition and Stable Process in Electroplating
High Temperature Zn-618 Brightener for Acidic Zinc Plating with High Gloss and Good Leveling Ability
FFI-22 Bright Acid Copper Plating Additive for Barrel Plating with Bright Deposit and Uniform Fine-Grained Finish
KCR-25 Chrome Plating Brightener with Fast Deposition Speed Chloride-Free Formula for High Micro-Hardness Hard Chromium Plating
Blue White Passivation trivalent chrome plating process With High Corrosion Resistance
OX-108 Sulfonic Ammonium Salt Anionic Surfactant Potassium Chloride Zinc Plating
Colorless Liquid CAS 100-44-7 Benzyl Chloride C7H7Cl
CAS 68555-36-2 WT Polyquaternium-2 Yellowish To Yellow Liquid
CAS 68797-57-9 Imidazole-Epichlorodydrin Copolymer(IZE) C6H9ClN2O

3 4 6 7 Ostatni, ubiegły, zeszły Całkowity 44 Strony